Mechanical Properties of Electronic Interconnected Conductive Adhesive and Drop Impact Behavior of Adhesive Bonding Point

Electronic interconnected conductive adhesive has a wide range of application prospects in portable electronic products. It is often subjected to drop impact conditions during service, resulting in a relatively high strain rate at the bonding point of tiny conductive adhesive. Therefore, the research on the mechanical behavior of conductive adhesive under a higher strain rate and the drop reliability of bonding point is particularly important. Herein, the rate-dependent properties of the epoxy resin-based isotropic conductive adhesive (ICA) with silver conductive particles were investigated by using the universal testing machine and the split Hopkinson pressure bar. Furthermore, the numerical simulation analysis of the conductive adhesive interconnection package structure under drop impact was carried out. The dynamic results show that the cured ICA is sensitive to strain rate. It is clear that the key bonding point appears at the four corners, and the small-angle drop is more dangerous than that of the horizontal drop. The long-side drop mode results in a relatively large stress and strain at the key bonding point in comparison with that of the short-side drop mode.